3D Superconducting interconnections
After a brief introduction to the main drivers of 3D integration in microelectronic systems, the presentation will focus on the latest laboratory results to give an overview of the interconnect panel for cryo applications. Starting with superconducting routing and via technology, RF components performances and thermal properties of superlattice interconnects will be presented. Followed by bumping and assembly processes, the presentation will end with new innovative approaches of low pitch superconductive bonding. Superconducting 3D key enabling technologies are now ready for the scale up, compatibility with solid state qubit devices needs to be explored!
Authors
- Olivier Mailliart
- Baptiste Jadot (ORCID: https://orcid.org/0000-0001-6870-4459)
- Edouard Deschaseaux
- Candice Thomas (ORCID: https://orcid.org/0000-0002-9794-1813)
- Céline Feautrier (ORCID: https://orcid.org/0000-0003-2740-2889)
- Jean-Philippe Michel (ORCID: https://orcid.org/0000-0002-2277-431X)
- P. Renaud (ORCID: https://orcid.org/0009-0000-1106-3515)
- Jean Charbonnier (ORCID: https://orcid.org/0000-0003-3769-3712)
- Frédéric Berger
- Christophe Dubarry (ORCID: https://orcid.org/0000-0002-6604-2997)
- Norman Vivien
- Rémi Franiatte
- Charles Bon-Mardion
- Corentin Beilvert
- Meriem Guergour
Publication Details
- Published
- 2025-04-22
- DOI
- https://doi.org/10.1117/12.3056415
- Citations
- 1
- Primary Topic
- Copper Interconnects and Reliability
- Type
- article
- Field-Weighted Citation Impact
- 0.43