EUV mask lifetime evaluation using stochastic process window through mask clean cycles
We evaluate the evolution of on-wafer stochastic process window for 1D and 2D patterns as a function of frontside mask clean cycles. Changes seen in the process window can be attributed back to subtle changes in mask properties that are characterized via various scatterometry and AFM techniques. These learnings will help guide design, OPC and mask manufacturing flows to enable stable mask lifetimes in HVM.
Authors
- Brian M. Watson (ORCID: https://orcid.org/0000-0001-5151-0471)
- Dave Kewley
- Amy Weatherly
- Vineet Vijayakrishnan Nair (ORCID: https://orcid.org/0000-0002-8970-2425)
- Tom Boettiger
- Anil Karumuri
- Ping Digaum
- L. Richard Hoffman (ORCID: https://orcid.org/0000-0003-2537-5311)
- Baorui Yang (ORCID: https://orcid.org/0009-0003-6079-6346)
- Scott L. Light
- Gisung Yoon
- S.L. Snyder
- Russell A. Shoemake
Institutions
- Micron (United States) (US)
Publication Details
- Published
- 2025-04-22
- DOI
- https://doi.org/10.1117/12.3048333
- Primary Topic
- Advancements in Photolithography Techniques
- Type
- article
- Field-Weighted Citation Impact
- 0.00