Lithography innovations for the artificial intelligence era
The growth in the semiconductor industry is accelerated by Artificial Intelligence (AI) applications, introducing new requirements for lithography equipment. Underlying these requirements are process technology innovations, like novel transistor designs, new integration schemes based on wafer-to-wafer bonding and advanced packaging technologies. This paper presents an overview of the key technology developments for DUV lithography equipment supporting these AI trends.
Authors
- Wim P. de Boeij
- Michael Kubis
- Mohamed El Kodadi (ORCID: https://orcid.org/0000-0003-1960-8334)
- Alberto Pirati
- Ahmed I. Zayed (ORCID: https://orcid.org/0000-0002-7878-826X)
- P. ten Berge
- J.T.C. Kool
- Jean Philippe van Damme
- Stefan Keij
- Aditya Deshpande (ORCID: https://orcid.org/0000-0002-4463-2697)
- Daan Slotboom
- Jeroen de Groot
- Yann Gutierrez
- Saurabh Singh (ORCID: https://orcid.org/0009-0009-4676-6144)
- Gianluca Gattobigio
- Antoine Kempen
- Arjan Gijsbertsen
- Jeannot Driedonkx
- Elliott Mc Namara
Institutions
- ASML (Netherlands) (NL)
Publication Details
- Published
- 2025-04-22
- DOI
- https://doi.org/10.1117/12.3050947
- Citations
- 1
- Primary Topic
- Nanofabrication and Lithography Techniques
- Type
- article
- Field-Weighted Citation Impact
- 0.67