0.33 NA EUV systems for high-volume manufacturing

ASML NXE:3400 and NXE:3600D scanners are now commonly used for High Volume Manufacturing (HVM) of 7 nm to 3 nm logic devices as well as 10 nm class memory devices. In 2024 the ASML NXE:3800E scanner has been released and started shipping to customers to support the next HVM nodes. In this paper we will share the latest performance of these systems, including improvements in overlay, critical dimension (CD) control, stability, reliability, and high productivity Furthermore, we will describe the latest technology supporting the ASML roadmap for further improving cost of technology via increased productivity and platform commonality. Lastly we will show the ASML NXE sustainability roadmap driving progress to drastically reduce the energy consumed for each wafer exposed on NXE systems.

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Publication Details

Published
2025-04-22
DOI
https://doi.org/10.1117/12.3051233
Citations
2
Primary Topic
3D IC and TSV technologies
Type
article
Field-Weighted Citation Impact
1.46
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article

0.33 NA EUV systems for high-volume manufacturing

Peter Klomp
2 citations
3D IC and TSV technologies
1.46
article

0.33 NA EUV systems for high-volume manufacturing

Peter Klomp
article en
2 citations

Abstract

ASML NXE:3400 and NXE:3600D scanners are now commonly used for High Volume Manufacturing (HVM) of 7 nm to 3 nm logic devices as well as 10 nm class memory devices. In 2024 the ASML NXE:3800E scanner has been released and started shipping to customers to support the next HVM nodes. In this paper we will share the latest performance of these systems, including improvements in overlay, critical dimension (CD) control, stability, reliability, and high productivity Furthermore, we will describe the latest technology supporting the ASML roadmap for further improving cost of technology via increased productivity and platform commonality. Lastly we will show the ASML NXE sustainability roadmap driving progress to drastically reduce the energy consumed for each wafer exposed on NXE systems.

ASML (Netherlands) (NL)
Openalex Percentile: Top 18%
3D IC and TSV technologies
1.46
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