Scaling EUV and holistic lithography to support Moore’s Law through the AI era

Strong trends drive the semiconductor industry: ubiquitous computing, the energy transformation and artificial intelligence, to name just a few, have the potential to propel the industry towards $1 trillion of sales by 2030. Enabling this trajectory is the extension of Moore’s Law through innovation in semiconductor devices, materials, manufacturing technologies and 3D integration. To enable chip makers in their pursuit of more powerful, smaller, cheaper, more integrated and more energy-efficient chips, ASML focuses on driving a holistic lithography roadmap with innovation across the entire product and service portfolio. At the core of it is EUV lithography technology. EUV is now mature, and the roadmap offers further improvements in imaging performance, accuracy and productivity, as well as a major reduction in cost per wafer. EUV technology must however be complemented with a large suite of lithography, metrology and process control applications to optimize cost and performance. In 2024, ASML has shipped several High NA EUV systems and is enabling customers to prepare High NA insertion by supporting its customers’ R&D with those systems, as well as in its High NA lab in Veldhoven, the Netherlands. The new High NA optics, combined with progress on the EUV source, provide the foundation for the future of EUV in the form of a common platform, capable of carrying 0.33 NA, 0.55 NA and 0.75 NA and providing a significant cost reduction opportunity. Our progress on multi-beam, wafer bonding process control and DUV lithography for advanced packaging are the other critical elements ASML is providing in support of Moore’s Law. ASML is committed to push technology to new limits, partnering with all members of our ecosystem, to enable chip makers to realize their ambitions.