Solder mask as a reliable insulation layer on printed circuit boards–different layouts and materials under humidity and high voltage

After decades of improvement, the reliability of Printed Circuit Boards (PCB) is well known and standardized. However, the standards are based on outdated material properties and old experiments and thus, they contain a large safety margin, when modern insulation materials are applied. This work focuses on the insulation properties and the reliability of solder mask under high humidity and high voltages. It has been demonstrated that significantly more robust systems can be achieved than the standards specify. This leads the way for further volume reductions. • PCB reliability is well-known and standardized after decades of improvement. • Current standards are outdated, based on old material properties and experiments. • Results show that more robust systems are achievable than specified by current standards. • This opens possibilities for further volume reductions in PCB design.