Study on Microstructure and Properties of Friction-Assisted Electrodeposition Cu-SiC Deposited Layer

Based on the friction phenomenon, this study proposes a new method for localized electrodeposition preparation and prepares Cu-SiC composite deposited layers on copper substrates. The morphology of the deposited layer was observed using optical microscopy; the physical phase of the deposited layer was analyzed by X-ray diffraction; and the microstructure and size of the deposited layer were examined using scanning electron microscopy. The wear resistance of the deposited layer was evaluated through friction and wear experiments. The study found that the friction speed significantly influenced the morphology and size of the deposited layer. At a friction speed of 40 mm/s, the width of the deposited layer increased by 68.7%. Under the friction effect, the wear resistance of the deposited layer was improved. The coefficient of friction and wear width were reduced by 25.6% and 21.2%, respectively. The electrodeposited layer microstructure indicates that increasing the friction speed helps refine the microstructure. This has a significant impact on improving the performance of the electrodeposited layer.