Self-Heating Effects in RF Region of FDSOI MOSFETs at Cryogenic Temperatures
Radio-frequency (RF) circuits are crucial to qubit manipulation, for which transistor self-heating effects may influence performance and possibly change the quantum state. This paper presents an analytical RF model of FDSOI MOSFETs considering dynamic self-heating effects down to 3.3K for the first time. Parameter extraction involves analytical calculation and optimization using the iteratively re-weighted least squares (IRLS) and Monte Carlo methods. The temperature rise is estimated by capturing the correlation between thermal resistance and device temperature. This work provides a method for modeling FDSOI RF performance and for analyzing dynamic self-heating effects at cryogenic temperatures.
Authors
- Edoardo Charbon (ORCID: https://orcid.org/0000-0002-0620-3365)
- Christian Enz (ORCID: https://orcid.org/0000-0002-9968-5278)
- Hung-Chi Han (ORCID: https://orcid.org/0000-0001-9900-5618)
Institutions
- École Polytechnique Fédérale de Lausanne (CH)
Publication Details
- Journal
- IEEE Journal of the Electron Devices Society
- Published
- 2025-01-01
- DOI
- https://doi.org/10.1109/jeds.2025.3562752
- Primary Topic
- Advancements in Semiconductor Devices and Circuit Design
- Type
- article
- Field-Weighted Citation Impact
- 0.00