Reinforcement-Learning-Based Test Point Insertion for Power-Safe Testing in Monolithic 3-D ICs

Monolithic 3D (M3D) integration for integrated circuits (ICs) offers the promise of higher performance and lower power consumption over stacked-3D ICs. However, M3D suffers from large power supply noise (PSN) in the power distribution network due to high current demand and long conduction paths from voltage sources to local receivers. Excessive switching activities during the capture cycles in at-speed delay testing exacerbate the PSN-induced voltage droop problem. Therefore, PSN reduction is necessary for M3D ICs during testing to prevent the failure of good chips on the tester (i.e., yield loss). In this paper, we first develop an analysis flow for M3D designs to compute the PSN-induced voltage droop. Based on the analysis results, we extract the test patterns that are likely to cause yield loss. Next, we propose a reinforcement learning (RL)-based framework to insert test points and generate low-switching patterns that help in mitigating PSN without degrading the test coverage. Simulation results for benchmark M3D designs demonstrate the effectiveness of the proposed power-safe testing approach, compared to baseline cases that utilize commercial tools.

Authors

Institutions

Publication Details

Journal
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Published
2025-04-21
DOI
https://doi.org/10.1109/tcad.2025.3562950
Primary Topic
Integrated Circuits and Semiconductor Failure Analysis
Type
article
Field-Weighted Citation Impact
0.00

Funders

Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Reinforcement-Learning-Based Test Point Insertion for Power-Safe Testing in Monolithic 3-D ICs

Shao-Chun Hung, Krishnendu Chakrabarty, Arjun Chaudhuri
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Integrated Circuits and Semiconductor Failure Analysis
article

Reinforcement-Learning-Based Test Point Insertion for Power-Safe Testing in Monolithic 3-D ICs

Shao-Chun Hung, Krishnendu Chakrabarty, Arjun Chaudhuri
article en

Abstract

Monolithic 3D (M3D) integration for integrated circuits (ICs) offers the promise of higher performance and lower power consumption over stacked-3D ICs. However, M3D suffers from large power supply noise (PSN) in the power distribution network due to high current demand and long conduction paths from voltage sources to local receivers. Excessive switching activities during the capture cycles in at-speed delay testing exacerbate the PSN-induced voltage droop problem. Therefore, PSN reduction is necessary for M3D ICs during testing to prevent the failure of good chips on the tester (i.e., yield loss). In this paper, we first develop an analysis flow for M3D designs to compute the PSN-induced voltage droop. Based on the analysis results, we extract the test patterns that are likely to cause yield loss. Next, we propose a reinforcement learning (RL)-based framework to insert test points and generate low-switching patterns that help in mitigating PSN without degrading the test coverage. Simulation results for benchmark M3D designs demonstrate the effectiveness of the proposed power-safe testing approach, compared to baseline cases that utilize commercial tools.

IEEE Transactions on Computer-Aided Design of Integrated Circuits and SystemsVol. 44(11)
Nvidia (United States) (US), Arizona State University (US)
National Science Foundation
Openalex Percentile: Top 94%
Integrated Circuits and Semiconductor Failure Analysis
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.

Reinforcement-Learning-Based Test Point Insertion for Power-Safe Testing in Monolithic 3-D ICs — Shao-Chun Hung, Krishnendu Chakrabarty, et al. · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (2025) | TGRS Research Map | TGRS