Interface Properties Improvement and VFB Modulation on HfO₂/IL/Si₀.₇Ge₀.₃ Gate Stacks Using LaFMD Passivation Without EOT Compensation
The interface properties improvement and flat band voltage (V<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">FB</sub>) modulation of HfO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub>/IL/Si<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.7</sub>Ge<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.3</sub> gate stacks using a novel La(iPr<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub>-FMD)<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> (LaFMD) passivation technique without equivalent oxide thickness (EOT) compensation is investigated for the first time. The optimized sample under 5 cycles of LaFMD passivation reduces the interface state density (Dit) from 4.11 × 10<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">12</sup> eV<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-1</sup> · cm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-2</sup> to 7.43 × 10<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">11</sup> eV<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-1</sup> · cm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-2</sup>, while achieving the V<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">FB</sub> modulation of 330 mV and EOT fluctuation of only 0.01nm. This is attributed to LaFMD passivation promoting the formation of GeO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> and La-O bonds in the interfacial layer and inhibiting the generation of GeO. Additionally, compared with La<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub>O<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> treatment, LaFMD passivation strategy also exhibits superior Dit and V<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">FB</sub> modulation capability at smaller EOT. As a result, it is a promising technology for the stacked SiGe channel GAA transistor in the future.
Authors
- Shengkai Wang (ORCID: https://orcid.org/0000-0002-9701-5107)
- Xiaotong Mao
- Fei Zhao (ORCID: https://orcid.org/0000-0002-2215-8074)
- Yu Zhou (ORCID: https://orcid.org/0000-0002-8912-1719)
- Xiaolei Wang (ORCID: https://orcid.org/0000-0001-9431-0058)
- Yongliang Li (ORCID: https://orcid.org/0000-0002-5590-861X)
- Shuai Yang (ORCID: https://orcid.org/0000-0001-9798-2239)
- Jianfeng Gao (ORCID: https://orcid.org/0000-0002-0970-3568)
- Xiaofeng Jia
- Haoyan Liu (ORCID: https://orcid.org/0000-0002-2873-1409)
- Longyu Sun (ORCID: https://orcid.org/0009-0007-3687-7997)
Institutions
- Chinese Academy of Sciences (CN)
- Institute of Microelectronics (CN)
Publication Details
- Journal
- IEEE Electron Device Letters
- Published
- 2025-04-21
- DOI
- https://doi.org/10.1109/led.2025.3562628
- Citations
- 2
- Primary Topic
- Integrated Circuits and Semiconductor Failure Analysis
- Type
- article
- Field-Weighted Citation Impact
- 1.46
Funders
- National Natural Science Foundation of China