Hermetic Package-Based 45 W Ku-Band GaN HPA MMIC for Aerospace Applications

This paper presents the design and test results of a 45 W high-power amplifier monolithic-microwave integrated circuit (HPA MMIC) for aerospace applications utilizing a 0.15 μmGaN on SiC process, as well as the test results after applying a metal-ceramic-based hermetic package. The fabricated MMIC was designed with a three-stage cascade structure to achieve a high gain in both small- and large-signal performances. Measurements were conducted under radio-frequency pulse signal conditions with a 100 μs pulse width and 10 %duty cycle for both the MMIC die and hermetically packaged MMIC. The MMIC die operates in the 14~16 GHz band, delivering an output power of 46.7 dBm, a power-added efficiency (PAE) of 35.6 %, and a power gain of 23.7 dB. The hermetically packaged MMIC exhibited an output power of 45 W, a PAE of 30 %, and a power gain of 24.3 dB. The chip size of the fabricated MMIC was 4.5 × 4.5 mm2, and the size of the hermetic package was 10 × 12 mm2, making it suitable for use in the transmitter modules of aerospace wireless systems that require high power, light weight, and high reliability.