Delamination behaviour of the meter‐long class Fe(Se,Te) coated conductor tapes

FeSeTe coated conductor (CC) tapes have garnered significant attention due to their simple crystal structure, straightforward preparation process, elimination of the need for heat treatment, and the absence of the toxic element arsenic (As). The material's development is progressing favorably, with the successful production of meter-long class tapes. To facilitate its broader application, this study investigates the transverse delamination strength of FeSeTe CC tapes, with a particular focus on the impact of temperature and the location of delamination occurrences. The mechanical delamination tests were conducted using the anvil method, while the microstructure of the fracture surfaces was analyzed using transmission electron microscopy (TEM). The results indicate that the average transverse delamination strength of copper electroplated tapes at room temperature (RT) is 1.77 MPa, which decreases significantly to 0.74 MPa at 77 K, highlighting the substantial impact of low temperature on the mechanical properties of the tapes. TEM analysis revealed that most delamination occurs at the superconductor layer. These findings provide valuable insights for optimizing the mechanical performance of FeSeTe CC tapes for practical applications.