Structural basis for Polθ-helicase DNA binding and microhomology-mediated end-joining

DNA double-strand breaks (DSBs) present a critical threat to genomic integrity, often precipitating genomic instability and oncogenesis. Repair of DSBs predominantly occurs through homologous recombination (HR) and non-homologous end joining (NHEJ). In HR-deficient cells, DNA polymerase theta (Polθ) becomes critical for DSB repair via microhomology-mediated end joining (MMEJ), also termed theta-mediated end joining (TMEJ). Thus, Polθ is synthetically lethal with BRCA1/2 and other HR factors, underscoring its potential as a therapeutic target in HR-deficient cancers. However, the molecular mechanisms governing Polθ-mediated MMEJ remain poorly understood. Here we present a series of cryo-electron microscopy structures of the Polθ helicase domain (Polθ-hel) in complex with DNA containing different 3'-ssDNA overhangs. The structures reveal the sequential conformations adopted by Polθ-hel during the critical phases of DNA binding, microhomology searching, and microhomology annealing. The stepwise conformational changes within the Polθ-hel subdomains and its functional dimeric state are pivotal for aligning the 3'-ssDNA overhangs, facilitating the microhomology search and subsequent annealing necessary for DSB repair via MMEJ. Our findings illustrate the essential molecular switches within Polθ-hel that orchestrate the MMEJ process in DSB repair, laying the groundwork for the development of targeted therapies against the Polθ-hel.

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Publication Details

Journal
Nature Communications
Published
2025-04-19
DOI
https://doi.org/10.1038/s41467-025-58441-x
Citations
9
Primary Topic
DNA Repair Mechanisms
Type
article
Field-Weighted Citation Impact
7.25

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article

Structural basis for Polθ-helicase DNA binding and microhomology-mediated end-joining

Xiaojiang S. Chen, Leonid Minakhin, Htet A. Khant, Fumiaki Ito et al.
9 citations
Nature Communications
DNA Repair Mechanisms
7.25
article

Structural basis for Polθ-helicase DNA binding and microhomology-mediated end-joining

Xiaojiang S. Chen, Leonid Minakhin, Htet A. Khant, Fumiaki Ito, Richard T. Pomerantz, Ziyuan Li
article en
9 citations

Abstract

DNA double-strand breaks (DSBs) present a critical threat to genomic integrity, often precipitating genomic instability and oncogenesis. Repair of DSBs predominantly occurs through homologous recombination (HR) and non-homologous end joining (NHEJ). In HR-deficient cells, DNA polymerase theta (Polθ) becomes critical for DSB repair via microhomology-mediated end joining (MMEJ), also termed theta-mediated end joining (TMEJ). Thus, Polθ is synthetically lethal with BRCA1/2 and other HR factors, underscoring its potential as a therapeutic target in HR-deficient cancers. However, the molecular mechanisms governing Polθ-mediated MMEJ remain poorly understood. Here we present a series of cryo-electron microscopy structures of the Polθ helicase domain (Polθ-hel) in complex with DNA containing different 3'-ssDNA overhangs. The structures reveal the sequential conformations adopted by Polθ-hel during the critical phases of DNA binding, microhomology searching, and microhomology annealing. The stepwise conformational changes within the Polθ-hel subdomains and its functional dimeric state are pivotal for aligning the 3'-ssDNA overhangs, facilitating the microhomology search and subsequent annealing necessary for DSB repair via MMEJ. Our findings illustrate the essential molecular switches within Polθ-hel that orchestrate the MMEJ process in DSB repair, laying the groundwork for the development of targeted therapies against the Polθ-hel.

Nature CommunicationsVol. 16(1)
University of Southern California (US), California NanoSystems Institute (US), Thomas Jefferson University (US), University of California, Los Angeles (US), Sidney Kimmel Cancer Center (US)
University of Southern California, National Institutes of Health, National Institute of General Medical Sciences, National Institute of Allergy and Infectious Diseases
Openalex Percentile: Top 3%
DNA Repair Mechanisms
7.25
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