Bi, Ni and Ce coaddition improving shear property and interfacial growth of SAC305 solder joint on Cu substrate
In this study, the shear property and interfacial growth of Sn-3.0Ag-0.5Cu (SAC305) and Sn-3.0Ag-0.5Cu-3Bi-0.05Ni-0.05Ce (SAC305-BNC) solder joints on Cu substrates during isothermal aging were investigated. The coaddition of Bi, Ni and Ce evidently enhanced shear strength of SAC305 alloy whether after aging or not, and changed the shear fracture from a transgranular failure to an intergranular failure. Cu 6 Sn 5 intermetallic compound (IMC) layer formed in the SAC305/Cu solder joints, (Cu,Ni) 6 Sn 5 and Cu 3 Sn IMC layers formed in the SAC305/Cu solder joints. The growth rates of IMC layers were slowed, and the Cu 6 Sn 5 grain size were refined by Bi, Ni and Ce coaddition during isothermal aging, thereby partly contributing to the increase of shear strength, and simultaneously improving the reliability of solder joints. • Bi, Ni and Ce coaddition evidently enhanced shear strength of SAC305 solder alloy. • Bi, Ni and Ce coaddition slowed growth rates of IMC layers, and refined Cu 6 Sn 5 grains. • Bi, Ni and Ce coaddition improved the stability and reliability of solder joints.
Authors
- Caiju Li (ORCID: https://orcid.org/0000-0002-9129-5611)
- Peng Gao (ORCID: https://orcid.org/0000-0002-4311-584X)
- Qian Zhou (ORCID: https://orcid.org/0000-0001-6377-6226)
- Li Fu (ORCID: https://orcid.org/0000-0002-3236-9545)
- Mi Wu
- Lei Li (ORCID: https://orcid.org/0000-0001-5359-9684)
- Qiong Lu (ORCID: https://orcid.org/0000-0002-7216-8676)
- Yingde Miao
Institutions
- Kunming University of Science and Technology (CN)
Publication Details
- Journal
- Microelectronics Reliability
- Published
- 2025-04-17
- DOI
- https://doi.org/10.1016/j.microrel.2025.115752
- Citations
- 2
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 1.46