Composites of an epoxy and two‐dimensional boron nitride nanosheets (<scp>BNNS</scp>) as a coating for efficient thermal management of electronic devices

Abstract Efficient thermal management is an increasingly important factor in the development of future electronic devices where operating speed, device lifespan and safety are determined by optimising heat dissipation to reduce component temperature. The heat generated during continuous and/or cyclic operation can be dissipated using thermal interface materials (TIMs). A facile yet novel method based on a combination of centrifugal mixing and micropipetting was very effective at accurately depositing thin layers of an epoxy filled with a highly interconnected boron nitride nanosheet (BNNS) network. The use of composites of an epoxy and BNNS as a TIM was assessed by measuring the operating temperature of a diode on a printed circuit board, to replicate in‐service use, using thermal imaging. The operating temperature of the device decreased by almost 57 °C on inclusion of a BNNS volume fraction ( φ ) of 0.15 and the thermal resistance by ca 50%. The device displayed excellent thermal stability and a consistent temperature response during cyclical operations over 10 h. The reliability of transistors depends exponentially upon operating temperature and even a 10–15 °C reduction can double the lifespan of an electronic device. © 2025 The Author(s). Polymer International published by John Wiley &amp; Sons Ltd on behalf of Society of Chemical Industry.