Novel Antenna-in-Package Design Based on Endfire Radiation Subarray Decomposition to Format Broadside Array at Sub-THz Frequencies

A novel antenna-in-package (AiP) of a two-dimensional (2-D) array is proposed for Sub-THz applications at the 250-310GHz band. The 2-D array is decomposed into several one-dimensional (1-D) row subarrays realized on a multilayered dielectric-substrate panel. To produce sufficient space for active RF transceiver module accommodation, the 1-D row subarrays are designed to radiate end-fire patterns from along the edge direction of the dielectric panel such that the space behind the antenna can be freely used with limitations. Afterward, several panels of the 1-D row subarrays are stacked vertically to form the 2-D AiP array by utilizing glued dummy wafers or low-temperature soldering ball grid arrays (BGAs), whose thickness may produce a cavity to accommodate the RF transceivers and build the RF signal paths in AiP operation. After the stack up of forming a rectangular array, the antenna is turned around by 90 degrees to face upward, which transforms the end-fire radiation into a broadside one, as desired by the ordinary AiP. This AiP has dual-linear polarization radiations that can align with the base station antenna for polarization matching. Full-wave simulations are presented to demonstrate the design concepts, where measurement results of a 1-D row array are also presented to validate the design and exhibit the radiation characteristics.