High crosslink density and nano-ano enhancement: Performance of bisphenol A epoxy resin adhesives in corrosive environment

Traditional inkjet printheads typically utilize adhesives to combine electronic components with piezoelectric materials . When immersed in ink for extended periods, the interface often experiences debonding. To address this issue, we developed an epoxy resin adhesive by using bisphenol A epoxy resin and curing agent DDM, and simultaneously incorporating nano-SiO₂ as a filler. Through non-isothermal kinetics, we optimized the curing temperature and determined its activation energy to be 52.8 kJ mol −1 , fitting the SB (m, n) model. The highly crosslinked network it forms can effectively resist the intrusion of water and solvents. Results indicate that 2.0 wt% nano-SiO₂ is optimal, reducing liquid absorption rates in ethylene glycol ether and water by 78 % and 17.2 %, respectively, over 180 days. DMA and XPS tests show that nano-SiO₂ increases the crosslinking density and mechanical stability , resulting in higher storage modulus and glass transition temperature . An addition of 2.0 wt% provided the highest strength before and after aging. FTIR spectra before and after aging indicate that the adhesive did not undergo hydrolysis, and the addition of nano-SiO₂ reduces the absorption rates of solvents and water. Our research offers valuable insights for developing high-performance adhesives suitable for corrosive environments , such as inkjet printheads.