A Novel Transient Thermal Characterization System for Power Modules
Thermal design of power modules has been required to ensure long-term reliability for industrial applications. The static test method utilizes the temperature dependency of I-V characteristics on power devices to characterize the transient thermal resistance of power module packages. With modern power modules achieving high heat dissipation performance, accurate transient thermal characterization demands precise measurement of the fast and small voltage responses associated with their enhanced thermal performance. This paper develops an advanced transient thermal characterization system to capture the fast and small electrical response of power modules for their appropriate thermal characterization. The performance of the developed system is evaluated based on the experiment compared with the conventional characterization system and is validated with numerical simulation.
Authors
- Shuhei Fukunaga (ORCID: https://orcid.org/0000-0001-6058-2047)
- Tsuyoshi Funaki (ORCID: https://orcid.org/0000-0001-8776-5118)
Institutions
- The University of Osaka (JP)
Publication Details
- Journal
- IEEE Journal of Emerging and Selected Topics in Power Electronics
- Published
- 2025-04-17
- DOI
- https://doi.org/10.1109/jestpe.2025.3561893
- Citations
- 2
- Primary Topic
- Induction Heating and Inverter Technology
- Type
- article
- Field-Weighted Citation Impact
- 1.43
Funders
- Nagamori Foundation
- Ministry of Education, Culture, Sports, Science and Technology
- Japan Society for the Promotion of Science