Rapid Drying Principle for High‐speed, Pinhole‐Less, Uniform Wet Deposition Protocols of Water‐Dispersed 2D Materials (Adv. Mater. 15/2025)
Rapid Drying Rapid drying is a key principle for scalable, high-speed, uniform, and pinhole-less deposition of 2D materials. Using hot dipping and air knife sweeping (AKS), deposition speeds up to 0.21 m2 min−1 are achieved, surpassing conventional protocols by 2–4 orders of magnitude. This approach can extend to 1D and 3D materials if they are uniformly dispersible in rapidly evaporable liquids. More details can be found in article number 2411447 by, Chuan Wang, Dongwook Lee, and co-workers.
Authors
- Heechae Choi (ORCID: https://orcid.org/0000-0002-9390-6607)
- Junyi Zhao (ORCID: https://orcid.org/0000-0001-6941-0559)
- Alloyssius E.G. Gorospe
- Soo‐Hyung Choi (ORCID: https://orcid.org/0000-0002-4078-6285)
- Hyun‐Sik Kim (ORCID: https://orcid.org/0000-0001-8934-4042)
- Jeong‐Yeon Kim
- Jun-Hyun Bae (ORCID: https://orcid.org/0009-0004-0593-5670)
- Ki‐Hun Jeong (ORCID: https://orcid.org/0000-0003-4799-7816)
- Seung Joon Yoo (ORCID: https://orcid.org/0000-0002-1531-7700)
- Dongwook Lee (ORCID: https://orcid.org/0000-0002-2805-3353)
- Chuan Wang (ORCID: https://orcid.org/0000-0002-5296-0631)
- Ha Young Lee (ORCID: https://orcid.org/0000-0002-3528-183X)
- You Jin Kim (ORCID: https://orcid.org/0000-0002-2192-729X)
- Chansoo Kim (ORCID: https://orcid.org/0000-0002-7231-7782)
Institutions
- University of Seoul (KR)
- Washington University in St. Louis (US)
- Gwangju Institute of Science and Technology (KR)
- Xi’an Jiaotong-Liverpool University (CN)
- Hongik University (KR)
Publication Details
- Journal
- Advanced Materials
- Published
- 2025-04-01
- DOI
- https://doi.org/10.1002/adma.202570120
- Primary Topic
- Additive Manufacturing and 3D Printing Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00