Cryogenic properties of copper produced by Atomic Diffusion Additive Manufacturing (ADAM)

Atomic Diffusion Additive Manufacturing (ADAM) represents cutting-edge technology in the field of cost-effective additive manufacturing, while the vacuum tightness and thermal properties of these materials are not fully measured, especially at low, cryogenic temperatures. This study investigates the viability of utilizing ADAM for producing components intended for cryogenic heat transfer in vacuum. In this paper I will present the CryPT-ON (Cryogenic Performance Test) cryostat at the Fusion Plasma Physics Department of HUN-REN Centre for Energy Research, the specific experimental setup for thermal conductivity, diffusivity measurement and the 3D printed samples with X-ray fluorescence (XRF) and Scanning Electron Microscope (SEM) measurement to determine the material composition and have a better understanding of this special material and printing technology. • Assessed ADAM copper's thermal and vacuum properties at cryogenic conditions. • Found lower thermal conductivity and diffusivity compared to pure copper. • Identified vacuum tightness issues requiring post-processing like copper plating. • Demonstrated novel cryogenic measurement for 3D-printed materials.