Quantifying Localized Surface Plasmon Resonance Induced Enhancement on Metal@Cu <sub>2</sub> O Composites for Photoelectrochemical Water Splitting

The localized surface plasmon resonance (LSPR) of metal nanoparticles can substantially enhance the activity of photoelectrocatalytic (PEC) reactions. However, quantifying the respective contributions of different LSPR mechanisms to the enhancement of PEC performance remains an urgent challenge. In this work, Cu@Cu<sub>2</sub>O composites prepared by annealing Cu<sub>2</sub>O under an inert atmosphere and electrodeposited metal@Cu<sub>2</sub>O composites (M<sub>ED</sub>@Cu<sub>2</sub>O, M<sub>ED</sub> = Cu<sub>ED</sub>, Au<sub>ED</sub>, Ag<sub>ED</sub>, Pd<sub>ED</sub>, Pt<sub>ED</sub>) are employed as platform materials to investigate the LSPR effect on the PEC hydrogen evolution reaction (HER). All the composites exhibited remarkably LSPR-enhanced activity toward PEC HER. The contributions of two LSPR mechanisms, plasmon induced resonance energy transfer (PIRET) and hot electron transfer (HET), to the photocurrent on Cu@Cu<sub>2</sub>O and Cu<sub>ED</sub>@Cu<sub>2</sub>O are quantified by using different bands of incident light. Moreover, using M<sub>ED</sub>@Cu<sub>2</sub>O composites, the effects of both the metal species and the applied potential on HET are quantitatively investigated. The results reveal that a pronounced HET enhancement occurs only when the LSPR peak energy is lower than the semiconductor bandgap energy (E<sub>g</sub>) and that HET strengthens as the applied potential becomes more negative for PEC HER. This work therefore provides a quantitative understanding of the roles of PIRET and HET in boosting PEC activity.

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Publication Details

Journal
Advanced Materials
Published
2025-04-17
DOI
https://doi.org/10.1002/adma.202501069
Citations
27
Primary Topic
Copper-based nanomaterials and applications
Type
article
Field-Weighted Citation Impact
13.98

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article

Quantifying Localized Surface Plasmon Resonance Induced Enhancement on Metal@Cu 2 O Composites for Photoelectrochemical Water Splitting

Peng Diao, Tiantian Xiao
27 citations
Advanced Materials
Copper-based nanomaterials and applications
13.98
article

Quantifying Localized Surface Plasmon Resonance Induced Enhancement on Metal@Cu 2 O Composites for Photoelectrochemical Water Splitting

Peng Diao, Tiantian Xiao
article en
27 citations

Abstract

The localized surface plasmon resonance (LSPR) of metal nanoparticles can substantially enhance the activity of photoelectrocatalytic (PEC) reactions. However, quantifying the respective contributions of different LSPR mechanisms to the enhancement of PEC performance remains an urgent challenge. In this work, Cu@Cu<sub>2</sub>O composites prepared by annealing Cu<sub>2</sub>O under an inert atmosphere and electrodeposited metal@Cu<sub>2</sub>O composites (M<sub>ED</sub>@Cu<sub>2</sub>O, M<sub>ED</sub> = Cu<sub>ED</sub>, Au<sub>ED</sub>, Ag<sub>ED</sub>, Pd<sub>ED</sub>, Pt<sub>ED</sub>) are employed as platform materials to investigate the LSPR effect on the PEC hydrogen evolution reaction (HER). All the composites exhibited remarkably LSPR-enhanced activity toward PEC HER. The contributions of two LSPR mechanisms, plasmon induced resonance energy transfer (PIRET) and hot electron transfer (HET), to the photocurrent on Cu@Cu<sub>2</sub>O and Cu<sub>ED</sub>@Cu<sub>2</sub>O are quantified by using different bands of incident light. Moreover, using M<sub>ED</sub>@Cu<sub>2</sub>O composites, the effects of both the metal species and the applied potential on HET are quantitatively investigated. The results reveal that a pronounced HET enhancement occurs only when the LSPR peak energy is lower than the semiconductor bandgap energy (E<sub>g</sub>) and that HET strengthens as the applied potential becomes more negative for PEC HER. This work therefore provides a quantitative understanding of the roles of PIRET and HET in boosting PEC activity.

Advanced MaterialsVol. 37(28)
Beihang University (CN)
National Natural Science Foundation of China
Affordable and clean energy
Openalex Percentile: Top 1%
Copper-based nanomaterials and applications
13.98
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