Overview of Testing Methods for Mechanical and Adhesion Properties of Materials in Semiconductor Packages

Mechanical testing methodologies are essential for advancing semiconductor packaging processes, ensuring the mechanical reliability of devices subjected to increasingly complex manufacturing processes and operational conditions. In recent years, advanced packaging technologies, including system-in-package (SiP) using 2.xD and 3D integration, have played a crucial role in enabling high-performance electronic devices. However, the miniaturization of device structures and integration of materials with mismatched thermomechanical properties have introduced significant mechanical challenges, including warpage, interfacial delamination, and fracture-induced failures. This review comprehensively evaluates key mechanical testing methodologies used to characterize the material properties and interfacial reliability of materials in semiconductor packages. Techniques such as the tensile test and double-cantilever beam (DCB) test are critically examined, with a focus on their effectiveness in assessing thin-film mechanical behavior, adhesion properties, and fracture mechanisms in miniaturized semiconductor structures. Furthermore, this review highlights the limitations of traditional testing techniques in micro- and nanoscale applications and explores emerging testing approaches. By providing a comparative analysis of mechanical testing techniques and their applications in semiconductor packaging, this work aims to provide insights for optimizing reliability evaluation strategies and guiding future developments in advanced packaging technologies.