Layout Optimization of Dual-Directional SCR for Holding Voltage Equilibrium in ESD Applications
The reverse holding voltage of high-voltage (HV) dual-directional silicon-controlled rectifier (DDSCR) is usually degraded to a very low level due to the ubiquitous substrate guard ring. In this article, two symmetrical dual-finger layout configurations of DDSCR (DDSCR-DF1 and DDSCR-DF2) are proposed to restrain the degradation of negative holding voltage. By suppressing the parasitic current paths associated with the p-type guard ring (PGR) in all directions, experimental results indicate that the DDSCR-DF2 can effectively shield the substrate parasitic effects, thereby restoring the high holding voltage characteristic inherent in DDSCR kernel. Moreover, the dual-finger layout configuration presented here can be extended to various existing HV DDSCRs, thus providing a very useful layout optimization method for HV Electrostatic discharge (ESD) engineering.
Authors
- Jiaqiang Zheng (ORCID: https://orcid.org/0000-0001-9305-9711)
- Yimu Yang (ORCID: https://orcid.org/0000-0003-3674-3984)
- Zihan Zheng (ORCID: https://orcid.org/0009-0007-4480-5539)
- Fei Hou (ORCID: https://orcid.org/0000-0001-5763-4037)
- Feibo Du (ORCID: https://orcid.org/0000-0001-8622-2429)
- Ruibo Chen (ORCID: https://orcid.org/0000-0001-6993-9604)
- Dongxing Gao (ORCID: https://orcid.org/0000-0002-1329-0460)
- Xuyao Wang (ORCID: https://orcid.org/0000-0002-2690-2171)
- Zhiwei Liu (ORCID: https://orcid.org/0000-0003-0805-5930)
- Yi Liu (ORCID: https://orcid.org/0009-0001-0351-5259)
- Xiaoyu Dong (ORCID: https://orcid.org/0009-0001-5071-9473)
Institutions
- Xidian University (CN)
- University of Electronic Science and Technology of China (CN)
- Shenzhen University (CN)
- Shenzhen Technology University (CN)
Publication Details
- Journal
- IEEE Transactions on Electron Devices
- Published
- 2025-04-15
- DOI
- https://doi.org/10.1109/ted.2025.3558487
- Citations
- 2
- Primary Topic
- Electrostatic Discharge in Electronics
- Type
- article
- Field-Weighted Citation Impact
- 1.46