Advanced Chiplet Placement and Routing Optimization Considering Signal Integrity

This article addresses the critical challenges of chiplet placement and routing optimization in the era of advanced packaging and heterogeneous integration. We present a novel approach that formulates the problem as a signal integrity-aware hierarchical Markov decision process (MDP), leveraging the place-to-route (P2R) algorithm. Our method uniquely incorporates the universal chiplet interconnect express (UCIe) eye mask specifications to ensure compliance with datarate-dependent signal integrity requirements. Tested on 10 benchmark problems, P2R achieved superior results with an average eye-diagram aperture of 0.869 unit interval (UI) in a single iteration, outperforming random search and deep reinforcement learning by 44.8%. By addressing the combinatorial complexity and hard constraints inherent in chiplet-based designs, this approach enables optimization while ensuring compliance with industry standards. Our work represents a significant advancement in optimizing heterogeneous integrated systems, addressing challenges that conventional placement and routing methods cannot adequately solve.

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Institutions

Publication Details

Journal
IEEE Transactions on Components Packaging and Manufacturing Technology
Published
2025-04-15
DOI
https://doi.org/10.1109/tcpmt.2025.3561039
Citations
4
Primary Topic
VLSI and FPGA Design Techniques
Type
article
Field-Weighted Citation Impact
2.92

Funders

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article

Advanced Chiplet Placement and Routing Optimization Considering Signal Integrity

Joungho Kim, Byeongmok Kim, Joonsang Park, Junghyun Lee et al.
4 citations
IEEE Transactions on Components Packaging and Manufacturing Technology
VLSI and FPGA Design Techniques
2.92
article

Advanced Chiplet Placement and Routing Optimization Considering Signal Integrity

Joungho Kim, Byeongmok Kim, Joonsang Park, Junghyun Lee, Taein Shin, Haeyeon Kim, Federico Berto, Jihun Kim, Youngwoo Kim, Seonguk Choi, Jiwon Yoon
article en
4 citations

Abstract

This article addresses the critical challenges of chiplet placement and routing optimization in the era of advanced packaging and heterogeneous integration. We present a novel approach that formulates the problem as a signal integrity-aware hierarchical Markov decision process (MDP), leveraging the place-to-route (P2R) algorithm. Our method uniquely incorporates the universal chiplet interconnect express (UCIe) eye mask specifications to ensure compliance with datarate-dependent signal integrity requirements. Tested on 10 benchmark problems, P2R achieved superior results with an average eye-diagram aperture of 0.869 unit interval (UI) in a single iteration, outperforming random search and deep reinforcement learning by 44.8%. By addressing the combinatorial complexity and hard constraints inherent in chiplet-based designs, this approach enables optimization while ensuring compliance with industry standards. Our work represents a significant advancement in optimizing heterogeneous integrated systems, addressing challenges that conventional placement and routing methods cannot adequately solve.

IEEE Transactions on Components Packaging and Manufacturing TechnologyVol. 15(11)
Korea Advanced Institute of Science and Technology (KR), Sejong University (KR)
National Research Foundation of Korea
Openalex Percentile: Top 9%
VLSI and FPGA Design Techniques
2.92
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Advanced Chiplet Placement and Routing Optimization Considering Signal Integrity — Joungho Kim, Byeongmok Kim, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology (2025) | TGRS Research Map | TGRS