Mixed-Mode Fiber Array Alignment and Coupling to Photonic Integrated Circuits

This study investigates alignment and coupling between a photonic integrated circuit (PIC) and a mixed-mode fiber array, where one of the channels in the normally single-mode (SM) array is replaced by a multi-mode fiber (MMF). As a result, the tolerances of alignment are significantly relaxed. The proposed method suggests using the SMF at the input and the MMF at the output of the PIC. In such a transmission configuration, the tolerances are relaxed by a factor of √2 (41%). As this scales with mode size, the beam-expansion mechanisms, e.g., utilizing micro-lenses, can further significantly reduce the requirements for fabrication and packaging of photonic devices, making them more robust and cheaper to manufacture.

Authors

Publication Details

Journal
IEEE Transactions on Components Packaging and Manufacturing Technology
Published
2025-04-15
DOI
https://doi.org/10.1109/tcpmt.2025.3560722
Primary Topic
Photonic and Optical Devices
Type
article
Field-Weighted Citation Impact
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article

Mixed-Mode Fiber Array Alignment and Coupling to Photonic Integrated Circuits

Kamil Gradkowski
IEEE Transactions on Components Packaging and Manufacturing Technology
Photonic and Optical Devices
article

Mixed-Mode Fiber Array Alignment and Coupling to Photonic Integrated Circuits

Kamil Gradkowski
article en

Abstract

This study investigates alignment and coupling between a photonic integrated circuit (PIC) and a mixed-mode fiber array, where one of the channels in the normally single-mode (SM) array is replaced by a multi-mode fiber (MMF). As a result, the tolerances of alignment are significantly relaxed. The proposed method suggests using the SMF at the input and the MMF at the output of the PIC. In such a transmission configuration, the tolerances are relaxed by a factor of √2 (41%). As this scales with mode size, the beam-expansion mechanisms, e.g., utilizing micro-lenses, can further significantly reduce the requirements for fabrication and packaging of photonic devices, making them more robust and cheaper to manufacture.

IEEE Transactions on Components Packaging and Manufacturing TechnologyVol. 15(6)
Affordable and clean energy
Openalex Percentile: Top 94%
Photonic and Optical Devices
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