Study of Electrochemical Migration Behavior of Sn1.0Ag Solder

With the enhancement of environmental protection awareness and the implementation of related regulations, lead-free soldering materials are gradually replacing the traditional leaded soldering materials in the field of electronics manufacturing. Sn–Ag soldering materials have become a research hotspot because of their good mechanical properties, solderability, and thermal fatigue reliability, but their high cost limits their large-scale application. The low silver content of the Sn–Ag solder reduces the cost while maintaining an excellent performance. However, as the size of electronic components shrinks and the package density increases, the solder joint spacing decreases, the potential gradient increases, and electrochemical migration (ECM) becomes a key factor affecting the reliability of solder joints. In this study, the ECM failure process was simulated by the water droplet method, and the SEM and XPS analyses were utilized to investigate the ECM mechanism of Sn1.0Ag solder alloys, and the effects of different concentrations of NaCl solutions on their ECM were investigated. The results showed that the ECM of the Sn1.0Ag solder occurred in a 0.01 M NaCl solution, the dendritic composition was pure Sn, and the white precipitate was a mixture of Sn(OH)2 and Sn(OH)4. With the increase in the NaCl concentration, the corrosion resistance of the Sn1.0Ag solder alloy decreases and the ECM reaction intensifies, but with a high concentration of the NaCl solution, a large amount of precipitation hinders the migration of Sn ions, resulting in the generation of no dendrites. The present study provides new insights into the ECM behavior of a low-silver-content Sn–Ag solder system.