Enhancement-mode GaN/AlGaN p-channel field effect transistors with <i>I</i>D <b>&amp;gt;</b> 110 mA/mm achieved through source/drain tunnel junction contacts

In this Letter, we present enhancement-mode (E-mode) GaN/AlGaN p-channel metal-oxide-semiconductor field effect transistors (MOSFETs) with excellent performance by introduction of polarization induced tunnel junctions to enhance the source/drain (S/D) contacts and lateral current spreading in the access regions. The S/D contact resistance (RC) of 19.84 Ω·mm at voltage of 5 V was obtained. The fabricated GaN p-MOSFET has a threshold voltage (VTH) of −0.86 V, a high drain current (ID) up to 115 mA/mm, a low on-resistance (Ron) of 52.6 Ω·mm, and an on/off current ratio (ION/IOFF) of 7.2 × 104. The monolithically fabricated GaN power high electron mobility transistor shows a breakdown voltage (BV) more than 1700 V. The proposed technology of GaN p-MOSFETs was promising in the applications of GaN logic and drivers for all-GaN monolithic power integrated circuits.

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Publication Details

Journal
Applied Physics Letters
Published
2025-04-01
DOI
https://doi.org/10.1063/5.0256979
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
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article

Enhancement-mode GaN/AlGaN p-channel field effect transistors with ID &gt; 110 mA/mm achieved through source/drain tunnel junction contacts

Weichuan Xing, Xiaojin Chen, Hanghai Du, Shenglei Zhao et al.
Applied Physics Letters
GaN-based semiconductor devices and materials
article

Enhancement-mode GaN/AlGaN p-channel field effect transistors with ID &gt; 110 mA/mm achieved through source/drain tunnel junction contacts

Weichuan Xing, Xiaojin Chen, Hanghai Du, Shenglei Zhao, Zhihong Liu, Xing Chen, Xiangdong Li, Yue Hao, Jincheng Zhang, Weihang Zhang, Zhaofeng Wang
article en

Abstract

In this Letter, we present enhancement-mode (E-mode) GaN/AlGaN p-channel metal-oxide-semiconductor field effect transistors (MOSFETs) with excellent performance by introduction of polarization induced tunnel junctions to enhance the source/drain (S/D) contacts and lateral current spreading in the access regions. The S/D contact resistance (RC) of 19.84 Ω·mm at voltage of 5 V was obtained. The fabricated GaN p-MOSFET has a threshold voltage (VTH) of −0.86 V, a high drain current (ID) up to 115 mA/mm, a low on-resistance (Ron) of 52.6 Ω·mm, and an on/off current ratio (ION/IOFF) of 7.2 × 104. The monolithically fabricated GaN power high electron mobility transistor shows a breakdown voltage (BV) more than 1700 V. The proposed technology of GaN p-MOSFETs was promising in the applications of GaN logic and drivers for all-GaN monolithic power integrated circuits.

Applied Physics LettersVol. 126(15)
Xidian University (CN), Wuhu Institute of Technology (CN)
National Natural Science Foundation of China
Openalex Percentile: Top 95%
GaN-based semiconductor devices and materials
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Enhancement-mode GaN/AlGaN p-channel field effect transistors with <i>I</i>D <b>&amp;gt;</b> 110 mA/mm achieved through source/drain tunnel junction contacts — Weichuan Xing, Xiaojin Chen, et al. · Applied Physics Letters (2025) | TGRS Research Map | TGRS