OFF-state breakdown and threshold voltage stability of vertical GaN-on-Si trench MOSFETs

In this paper we analyze the OFF-state performance of vertical GaN-on-Si Trench MOSFETs in terms of breakdown voltage and stability of the threshold voltage. We proved that the devices fail in OFF-state due to the breakdown of the unprotected gate oxide. Then, by means of a series of fast V TH transient experiments, we demonstrate that the OFF-state threshold voltage instability is given by the trapping of electrons at deep levels in the p-GaN body layer, transported by the rather high drain current leakage. The interpretation was supported by deep level spectroscopy measurements, carried out on p-n junctions located on the same wafer. • The breakdown in OFF-state regime of vertical GaN trench MOSFETs was investigated by means of stepstress experiments. • The failure of the devices is associated with an excess of electric field in the gate oxide layer. • We detected a V TH instability mechanisms during an OFF-state stress, associated to the vertical electric field or leakage. • V TH instability due to trapping of electrons in deep levels within the semiconductor layers.

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Publication Details

Journal
Microelectronics Reliability
Published
2025-04-14
DOI
https://doi.org/10.1016/j.microrel.2025.115716
Citations
1
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
1.26
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article

OFF-state breakdown and threshold voltage stability of vertical GaN-on-Si trench MOSFETs

Enrico Zanoni, F. Bergamin, Manuel Fregolent, D. Favero et al.
1 citations
Microelectronics Reliability
GaN-based semiconductor devices and materials
1.26
article

OFF-state breakdown and threshold voltage stability of vertical GaN-on-Si trench MOSFETs

Enrico Zanoni, F. Bergamin, Manuel Fregolent, D. Favero, Andrea Cester, Matteo Meneghini, Carlo De Santi, Gaudenzio Meneghesso, Christian Huber
article en
1 citations

Abstract

In this paper we analyze the OFF-state performance of vertical GaN-on-Si Trench MOSFETs in terms of breakdown voltage and stability of the threshold voltage. We proved that the devices fail in OFF-state due to the breakdown of the unprotected gate oxide. Then, by means of a series of fast V TH transient experiments, we demonstrate that the OFF-state threshold voltage instability is given by the trapping of electrons at deep levels in the p-GaN body layer, transported by the rather high drain current leakage. The interpretation was supported by deep level spectroscopy measurements, carried out on p-n junctions located on the same wafer. • The breakdown in OFF-state regime of vertical GaN trench MOSFETs was investigated by means of stepstress experiments. • The failure of the devices is associated with an excess of electric field in the gate oxide layer. • We detected a V TH instability mechanisms during an OFF-state stress, associated to the vertical electric field or leakage. • V TH instability due to trapping of electrons in deep levels within the semiconductor layers.

Microelectronics ReliabilityVol. 169
University of Padua (IT), Robert Bosch (Netherlands) (NL)
Affordable and clean energy
Openalex Percentile: Top 22%
GaN-based semiconductor devices and materials
1.26
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OFF-state breakdown and threshold voltage stability of vertical GaN-on-Si trench MOSFETs — Enrico Zanoni, F. Bergamin, et al. · Microelectronics Reliability (2025) | TGRS Research Map | TGRS