Proof of principle demonstration of electro driven silver nanowire for stretchable circuit junctions

The interlayer connection of circuits within stretchable electronic devices is crucial for enhancing their performance. Conventional methods for interlayer circuit connections are fragile and prone to mechanical deformation, prompting the need for new approaches. Although various methods have been proposed for creating interconnections in stretchable circuits, a universally efficient method for junctions remains to be fully developed. In this study, we propose a method to connect the interlayers of stretchable circuits using electro-driven silver nanowires. By comparing the conventional junction method with our proposed method, we verify the efficiency of the new approach. The results reveal that applying a high electric field during the solidification of the circuit interlayer aligns the isotropic state of the silver nanowires parallel to the field, thereby increasing the conductivity of the interlayer junction. Additionally, the study demonstrates that using silver nanowires for the junction provides better mechanical stability to the junction compared to that of the bulk material, as verified through mechanical stretch experiments. An in-depth analysis with mathematical modeling is presented at the end of the study. The proposed method is a promising approach for creating junctions in stretchable devices and is expected to pave the way for increasing their efficiency.