Self‐Reinforced <scp>PA11</scp> Films: Blown Film Processing as a Scalable Route for High‐Performance Dielectric Applications

ABSTRACT Polyamide 11 (PA11) is a promising polymer for dielectric applications due to its inherent chemical resistance, mechanical properties, and eco‐friendliness. However, its dielectric performance remains insufficient for high‐performance applications. This study introduces a cost‐effective and scalable blown film processing technique to enhance PA11's dielectric properties by optimizing molecular orientation and crystalline structure through biaxial coupling force fields. Systematic analysis using thermal analysis, 2D‐WAXD, and FTIR reveals that increasing the longitudinal force field and reducing the transverse force field significantly boosts the dielectric constant. Optimal performance is achieved at a draw ratio (DR) of 6 and a blow‐up ratio (BUR) of 1.5, yielding a 47% increase in dielectric constant and a low dielectric loss of 0.3.