Investigation and prediction of solid-state bonding quality of Al-0.5Mg-0.4Si alloy under different process parameters during hot compression bonding

Hot compression bonding (HCB) is the primary method of physical simulation of extrusion welding, and the process parameters significantly influence the quality of HCB. In this study, the bonding quality of Al-0.5Mg-0.4Si alloy under varying process parameters was investigated by combining experiment and numerical simulation. HCB tests of Al-0.5Mg-0.4Si alloy were conducted using a Gleeble-3500 thermal simulator at different temperatures and strain rates. The effects of various process parameters on the physical variables related to solid-state bonding were analyzed through numerical simulations. The influence of different process parameters on bonding quality was elucidated through shear tests and microstructural characterization. Based on these findings, a novel equation for predicting the quality of solid-state bonding was proposed. The results indicate that the quality of solid-state bonding is influenced by factors such as temperature, bonding time, strain, and the ratio of hydrostatic pressure to effective stress. Bonding quality improves with higher temperatures and lower strain rates. The content of oxides and voids at the bonding interface directly affects the bonding strength. The new equation demonstrates excellent accuracy in predicting solid-state bonding quality. This study provides a theoretical foundation for solid-state bonding of Al-0.5Mg-0.4Si alloy.