Monolithic integration of circuits in e-mode GaN HEMT technology

This work presents a power transistor with monolithically integrated gate driver and auxiliary circuit in the same GaN-on-Si die. It presents the design, the characterization and validation tests in a PCB similarly to a final application for this device. The target application is for USB-C chargers and power supplies for data centers. The technology is 650 V pGaN with Schottky gate. Simulation from -40 to 150 °C are performed and also fabrication process variation analysis (SS, FF) compared to typical values (TT).

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Publication Details

Journal
Power Electronic Devices and Components
Published
2025-04-09
DOI
https://doi.org/10.1016/j.pedc.2025.100089
Citations
1
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
1.26
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article

Monolithic integration of circuits in e-mode GaN HEMT technology

Thanh Hai Phung, T. Beauchêne, Plinio Bau, Stephane Driussi
1 citations
Power Electronic Devices and Components
GaN-based semiconductor devices and materials
1.26
article

Monolithic integration of circuits in e-mode GaN HEMT technology

Thanh Hai Phung, T. Beauchêne, Plinio Bau, Stephane Driussi
article en
1 citations

Abstract

This work presents a power transistor with monolithically integrated gate driver and auxiliary circuit in the same GaN-on-Si die. It presents the design, the characterization and validation tests in a PCB similarly to a final application for this device. The target application is for USB-C chargers and power supplies for data centers. The technology is 650 V pGaN with Schottky gate. Simulation from -40 to 150 °C are performed and also fabrication process variation analysis (SS, FF) compared to typical values (TT).

Power Electronic Devices and ComponentsVol. 11
Techniques of Informatics and Microelectronics for Integrated Systems Architecture (FR)
Affordable and clean energy
Openalex Percentile: Top 23%
GaN-based semiconductor devices and materials
1.26
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