Alternative splicing engineering modulation of thermal/electrical transmission properties in low-dimensional nanodevices based on five-carbon ring structures

Alternative splicing engineering is a potential strategy to improve the thermoelectric conversion efficiency of low-dimensional nanodevices. The unique thermal/electrical transport properties of 5-carbon ring-based structures can significantly improve thermoelectric performance. The thermoelectric properties of three carbon nanomaterials and devices containing five-carbon ring structures, namely, penta-graphene (PG), penta-octa-penta-graphene (POPG) and Θ-graphene (ΘG), were investigated using density functional theory and non-equilibrium Green's function methods. The results demonstrated that the folded structure of PG gave rise to ring-like electrical transport properties, which greatly reduced effective conductance. POPG exhibited smooth charge transport behavior without scattering loops, leading to relatively higher conductance compared to PG. Meanwhile, embedded 8-carbon ring structures effectively flattened the folded structure of PG and significantly reduced vertical oscillation behavior, resulting in an increase in thermal conductance. For ΘG, the addition of distorted 6-carbon ring structures excited reverse charge transport paths, resulting in lower conductance compared to POPG. The splicing geometry between the 5-carbon ring and 6-carbon ring structure disrupted the original grain boundaries, leading to enhanced phonon scattering and more localized vibrational modes. As a result, ΘG achieved a <i>ZT</i> value of 0.54 near the Fermi energy level at room temperature (300 K).

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Publication Details

Journal
Physical Chemistry Chemical Physics
Published
2025-01-01
DOI
https://doi.org/10.1039/d4cp04772a
Primary Topic
Advanced Thermoelectric Materials and Devices
Type
article
Field-Weighted Citation Impact
0.00

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article

Alternative splicing engineering modulation of thermal/electrical transmission properties in low-dimensional nanodevices based on five-carbon ring structures

Bei Zhang, Meng Qian
Physical Chemistry Chemical Physics
Advanced Thermoelectric Materials and Devices
article

Alternative splicing engineering modulation of thermal/electrical transmission properties in low-dimensional nanodevices based on five-carbon ring structures

Bei Zhang, Meng Qian
article en

Abstract

Alternative splicing engineering is a potential strategy to improve the thermoelectric conversion efficiency of low-dimensional nanodevices. The unique thermal/electrical transport properties of 5-carbon ring-based structures can significantly improve thermoelectric performance. The thermoelectric properties of three carbon nanomaterials and devices containing five-carbon ring structures, namely, penta-graphene (PG), penta-octa-penta-graphene (POPG) and Θ-graphene (ΘG), were investigated using density functional theory and non-equilibrium Green's function methods. The results demonstrated that the folded structure of PG gave rise to ring-like electrical transport properties, which greatly reduced effective conductance. POPG exhibited smooth charge transport behavior without scattering loops, leading to relatively higher conductance compared to PG. Meanwhile, embedded 8-carbon ring structures effectively flattened the folded structure of PG and significantly reduced vertical oscillation behavior, resulting in an increase in thermal conductance. For ΘG, the addition of distorted 6-carbon ring structures excited reverse charge transport paths, resulting in lower conductance compared to POPG. The splicing geometry between the 5-carbon ring and 6-carbon ring structure disrupted the original grain boundaries, leading to enhanced phonon scattering and more localized vibrational modes. As a result, ΘG achieved a <i>ZT</i> value of 0.54 near the Fermi energy level at room temperature (300 K).

Physical Chemistry Chemical PhysicsVol. 27(17)
Xinjiang University (CN)
National Natural Science Foundation of China
Affordable and clean energy
Openalex Percentile: Top 95%
Advanced Thermoelectric Materials and Devices
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