High-temperature insulating polyimide aerogels with a hierarchical porous hyper-cross-linked structure derived from aqueous polymerization of mesostructured silica-grafted Poly(amic acid) salt

Polyimide (PI) aerogels have garnered significant interest in thermal protection applications because of their excellent high-temperature resistance and broad operational range. Nevertheless, there are still research challenges, such as the extensive use of organic solvents, shrinkage during drying, and the need for improved thermal/electrical insulation and mechanical properties. Addressing these challenges is crucial for enhancing the practical application of PI aerogels in demanding environments. Herein, we propose a facile, green, and scalable method for fabricating freeze-dried PI aerogels via the aqueous polymerization of amino-functionalized mesoporous silica-grafted poly(amic acid) salts (PAAS- g -AMS). Our findings demonstrate that water-borne PI (W-PI)- g -AMS aerogels have a three-dimensional covalent network with a macroporous/mesoporous architecture, which minimizes molecular chain slippage and shrinkage during thermal imidization. The W-PI- g -AMS aerogels possess excellent properties, such as high porosity (>91 %), a low bulk density (122.4 mg cm −3 ), minimal shrinkage (8.1 %), good compressive strength (6.15 MPa) and modulus (1.86 MPa), a high degradation temperature ( T d5 % = 599.4 °C), a low fire growth rate index (0.075 W g −1 s −1 ), low thermal conductivity (0.08241 W m −1 K −1 ), and a remarkably low dielectric constant ( D k = 1.25 at 1 MHz) and dissipation factor ( D f = 0.001 at 1 MHz), indicating their potential for use as substitute materials for thermal and electrical superinsulation in the aerospace and transportation industries in extreme environments. • A green and scalable method for fabricating water-borne PI aerogels was developed through the aqueous polymerization of PAAS-g-AMS. • The W-PI-g-AMS aerogels feature a 3D covalent network that minimizes chain slippage and shrinkage during thermal imidization. • The W-PI-g-AMS aerogels demonstrated high thermal and electrical insulation performance under extreme environmental conditions.

Authors

Institutions

Publication Details

Journal
Polymer Testing
Published
2025-04-09
DOI
https://doi.org/10.1016/j.polymertesting.2025.108797
Citations
3
Primary Topic
Aerogels and thermal insulation
Type
article
Field-Weighted Citation Impact
2.27
Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

High-temperature insulating polyimide aerogels with a hierarchical porous hyper-cross-linked structure derived from aqueous polymerization of mesostructured silica-grafted Poly(amic acid) salt

Jaewon Choi, Hyeonuk Yeo, Jae Hui Park, Ki‐Ho Nam et al.
3 citations
Polymer Testing
Aerogels and thermal insulation
2.27
article

High-temperature insulating polyimide aerogels with a hierarchical porous hyper-cross-linked structure derived from aqueous polymerization of mesostructured silica-grafted Poly(amic acid) salt

Jaewon Choi, Hyeonuk Yeo, Jae Hui Park, Ki‐Ho Nam, Young Nam Kim, Jang Se-Eun
article en
3 citations

Abstract

Polyimide (PI) aerogels have garnered significant interest in thermal protection applications because of their excellent high-temperature resistance and broad operational range. Nevertheless, there are still research challenges, such as the extensive use of organic solvents, shrinkage during drying, and the need for improved thermal/electrical insulation and mechanical properties. Addressing these challenges is crucial for enhancing the practical application of PI aerogels in demanding environments. Herein, we propose a facile, green, and scalable method for fabricating freeze-dried PI aerogels via the aqueous polymerization of amino-functionalized mesoporous silica-grafted poly(amic acid) salts (PAAS- g -AMS). Our findings demonstrate that water-borne PI (W-PI)- g -AMS aerogels have a three-dimensional covalent network with a macroporous/mesoporous architecture, which minimizes molecular chain slippage and shrinkage during thermal imidization. The W-PI- g -AMS aerogels possess excellent properties, such as high porosity (>91 %), a low bulk density (122.4 mg cm −3 ), minimal shrinkage (8.1 %), good compressive strength (6.15 MPa) and modulus (1.86 MPa), a high degradation temperature ( T d5 % = 599.4 °C), a low fire growth rate index (0.075 W g −1 s −1 ), low thermal conductivity (0.08241 W m −1 K −1 ), and a remarkably low dielectric constant ( D k = 1.25 at 1 MHz) and dissipation factor ( D f = 0.001 at 1 MHz), indicating their potential for use as substitute materials for thermal and electrical superinsulation in the aerospace and transportation industries in extreme environments. • A green and scalable method for fabricating water-borne PI aerogels was developed through the aqueous polymerization of PAAS-g-AMS. • The W-PI-g-AMS aerogels feature a 3D covalent network that minimizes chain slippage and shrinkage during thermal imidization. • The W-PI-g-AMS aerogels demonstrated high thermal and electrical insulation performance under extreme environmental conditions.

Polymer TestingVol. 147
Kyungpook National University (KR), Korea Institute of Science and Technology (KR)
Openalex Percentile: Top 13%
Aerogels and thermal insulation
2.27
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.