Rate-dependent mechanical behavior of dual-phase structure of Sn interconnect materials

Abstract This study systematically investigates the effects of strain rate (from 1.67 × 10⁻5 to 10⁻1 s⁻1) on the tensile deformation and fracture behavior of β-Sn-based dual-phase alloys including Sn5Sb, Sn25Sb, Sn37Pb, and Sn58Bi. Both pure Sn and Sn5Sb exhibit an increased elongation with rising the strain rate, while Sn25Sb, Sn37Pb, and Sn58Bi display inversely a reduced ductility. At low strain rates, Sn37Pb and Sn58Bi demonstrate a superplastic behavior characterized by the stress index n values of 3.4 and 4.3, respectively, indicating a dominant deformation mechanism involving grain boundary migration/slip and dislocation climb. At high strain rates, their stress indices abruptly increase to 12.6 and 15.3, suggesting a transition to dislocation slip-controlled deformation. Pure Sn, Sn5Sb, and Sn37Pb maintain ductile fracture throughout the tested strain range, whereas Sn25Sb exhibits a brittle fracture under all loading rates. Notably, Sn58Bi shows a strain rate-dependent fracture mode transition: brittle fracture predominates at low strain rates but shifts to quasi-brittle fracture at elevated rates, revealing its unique strain rate-sensitive fracture mechanism.

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Publication Details

Journal
Journal of Materials Science Materials in Electronics
Published
2025-04-01
DOI
https://doi.org/10.1007/s10854-025-14551-2
Citations
1
Primary Topic
Electronic Packaging and Soldering Technologies
Type
article
Field-Weighted Citation Impact
0.73

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article

Rate-dependent mechanical behavior of dual-phase structure of Sn interconnect materials

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1 citations
Journal of Materials Science Materials in Electronics
Electronic Packaging and Soldering Technologies
0.73
article

Rate-dependent mechanical behavior of dual-phase structure of Sn interconnect materials

Yan Yu, Mohammed A. Amin, Mohamed E. Khalifa, Zhanhu Guo, Yingying Feng, Z.I. Zaki, Xin Zhang, Xiaojing Wang, Yongliang Wang, Xiaobin Luo, Jin Min Peng, Hongbo Lu, Yuanwei Jia
article en
1 citations

Abstract

Abstract This study systematically investigates the effects of strain rate (from 1.67 × 10⁻5 to 10⁻1 s⁻1) on the tensile deformation and fracture behavior of β-Sn-based dual-phase alloys including Sn5Sb, Sn25Sb, Sn37Pb, and Sn58Bi. Both pure Sn and Sn5Sb exhibit an increased elongation with rising the strain rate, while Sn25Sb, Sn37Pb, and Sn58Bi display inversely a reduced ductility. At low strain rates, Sn37Pb and Sn58Bi demonstrate a superplastic behavior characterized by the stress index n values of 3.4 and 4.3, respectively, indicating a dominant deformation mechanism involving grain boundary migration/slip and dislocation climb. At high strain rates, their stress indices abruptly increase to 12.6 and 15.3, suggesting a transition to dislocation slip-controlled deformation. Pure Sn, Sn5Sb, and Sn37Pb maintain ductile fracture throughout the tested strain range, whereas Sn25Sb exhibits a brittle fracture under all loading rates. Notably, Sn58Bi shows a strain rate-dependent fracture mode transition: brittle fracture predominates at low strain rates but shifts to quasi-brittle fracture at elevated rates, revealing its unique strain rate-sensitive fracture mechanism.

Journal of Materials Science Materials in ElectronicsVol. 36(10)
Taif University (SA), Inner Mongolia University (CN), Northumbria University (GB), Jiangsu University of Science and Technology (CN), Institute of New Materials (CN)
Taif University
Openalex Percentile: Top 30%
Electronic Packaging and Soldering Technologies
0.73
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