Rate-dependent mechanical behavior of dual-phase structure of Sn interconnect materials
Abstract This study systematically investigates the effects of strain rate (from 1.67 × 10⁻5 to 10⁻1 s⁻1) on the tensile deformation and fracture behavior of β-Sn-based dual-phase alloys including Sn5Sb, Sn25Sb, Sn37Pb, and Sn58Bi. Both pure Sn and Sn5Sb exhibit an increased elongation with rising the strain rate, while Sn25Sb, Sn37Pb, and Sn58Bi display inversely a reduced ductility. At low strain rates, Sn37Pb and Sn58Bi demonstrate a superplastic behavior characterized by the stress index n values of 3.4 and 4.3, respectively, indicating a dominant deformation mechanism involving grain boundary migration/slip and dislocation climb. At high strain rates, their stress indices abruptly increase to 12.6 and 15.3, suggesting a transition to dislocation slip-controlled deformation. Pure Sn, Sn5Sb, and Sn37Pb maintain ductile fracture throughout the tested strain range, whereas Sn25Sb exhibits a brittle fracture under all loading rates. Notably, Sn58Bi shows a strain rate-dependent fracture mode transition: brittle fracture predominates at low strain rates but shifts to quasi-brittle fracture at elevated rates, revealing its unique strain rate-sensitive fracture mechanism.
Authors
- Yan Yu (ORCID: https://orcid.org/0000-0002-4518-0573)
- Mohammed A. Amin (ORCID: https://orcid.org/0000-0001-5091-0641)
- Mohamed E. Khalifa (ORCID: https://orcid.org/0000-0003-4914-4796)
- Zhanhu Guo
- Yingying Feng (ORCID: https://orcid.org/0000-0002-9854-692X)
- Z.I. Zaki (ORCID: https://orcid.org/0000-0002-5690-2439)
- Xin Zhang (ORCID: https://orcid.org/0000-0001-7900-4984)
- Xiaojing Wang (ORCID: https://orcid.org/0000-0002-0225-6312)
- Yongliang Wang (ORCID: https://orcid.org/0000-0001-7263-9493)
- Xiaobin Luo (ORCID: https://orcid.org/0000-0002-9647-8134)
- Jin Min Peng
- Hongbo Lu
- Yuanwei Jia
Institutions
- Taif University (SA)
- Inner Mongolia University (CN)
- Northumbria University (GB)
- Jiangsu University of Science and Technology (CN)
- Institute of New Materials (CN)
Publication Details
- Journal
- Journal of Materials Science Materials in Electronics
- Published
- 2025-04-01
- DOI
- https://doi.org/10.1007/s10854-025-14551-2
- Citations
- 1
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.73
Funders
- Taif University