Development of an additively manufactured vapor chamber using hybrid wick structures

• This work presents the fabrication and testing of an entirely 3D-printed copper vapor chamber. • This structure demonstrates enhanced thermal performance, achieving efficient heat transfer and improved temperature uniformity. • A method was developed to determine the equivalent thermal conductivity based on a StarCCM + simulation. • A custom-designed insulated test bench was developed to evaluate the equivalent thermal conductivity of the vapor chamber. Effective thermal management is vital in various industries, from high-power electronics and data centres to automotive systems and renewable energy technologies. Vapor chambers (VCs), known for their excellent thermal properties, are commonly used in electronics such as smartphones and computers. However, extending their application to electrochemical devices like proton exchange membrane fuel cells requires a better understanding of the complex, multi-physics processes that influence their performance. Additionally, traditional manufacturing methods often involve complex and resource-demanding assembly, limiting the potential for design optimisation and system integration. This study presents a novel approach to fabricating a functional 3D-printed copper VC entirely in a single manufacturing step. Additive manufacturing enabled us to precisely design and control the wick structure, facilitating an investigation of its effects on liquid transport and thermal behaviour. The VC design features a hybrid wick structure, with a honeycomb pattern in the condenser and straight channels in the evaporator, ensuring uniform liquid distribution and minimising hotspots. Using thermal imaging and a numerical model, the thermal performance of the VC was evaluated. The prototype demonstrated a 72% higher equivalent thermal conductivity compared to copper and exhibited significantly improved temperature uniformity in the evaporating area. Our findings demonstrate that 3D-printed VCs can provide a highly efficient and adaptable solution for thermal management across multiple industries. This manufacturing approach opens new possibilities for creating tailored VCs that meet specific requirements in fields such as electronics, aerospace, and electrochemical systems. Furthermore, the ability to integrate VCs directly with the components they are designed to cool enhances overall system efficiency and reduces assembly complexity.