SoundLoc3D: Invisible 3D Sound Source Localization and Classification Using a Multimodal RGB-D Acoustic Camera
Accurately localizing 3D sound sources and estimating their semantic labels - where the sources may not be visible, but are assumed to lie on the physical surface of objects in the scene - have many real applications, including detecting gas leak and machinery malfunction. The audio-visual weak-correlation in such setting poses new challenges in deriving innovative methods to answer if or how we can use cross-modal information to solve the task. Towards this end, we propose to use an acoustic-camera rig consisting of a pinhole RGB-D camera and a coplanar four-channel microphone array (Mic-Array). By using this rig to record audio-visual signals from multiviews, we can use the cross-modal cues to estimate the sound sources 3D locations. Specifically, our framework SoundLoc3D treats the task as a set prediction problem, each element in the set corresponds to a potential sound source. Given the audio-visual weak-correlation, the set representation is initially learned from a single view microphone array signal, and then refined by actively incorporating physical surface cues revealed from multiview RGB-D images. We demonstrate the efficiency and superiority of SoundLoc3D on large-scale simulated dataset, and further show its robustness to RGB-D measurement inaccuracy and ambient noise interference.
Authors
- Niki Trigoni (ORCID: https://orcid.org/0000-0001-6236-9645)
- Yuhang He (ORCID: https://orcid.org/0000-0001-7679-9339)
- Anoop Cherian (ORCID: https://orcid.org/0000-0002-5566-0351)
- Sangyun Shin (ORCID: https://orcid.org/0000-0003-0766-4101)
- Andrew Markham (ORCID: https://orcid.org/0000-0001-5716-3941)
Institutions
- University of Oxford (GB)
- Mitsubishi Electric (United States) (US)
Publication Details
- Published
- 2025-02-26
- DOI
- https://doi.org/10.1109/wacv61041.2025.00528
- Citations
- 1
- Primary Topic
- Speech and Audio Processing
- Type
- article
- Field-Weighted Citation Impact
- 1.49
Funders
- Mitsubishi Electric Research Laboratories