Comprehensive Investigation of Bias Stress-Induced Instabilities in Highly Scaled ZnO FeFETs: Impact of Channel Thickness, Channel Length, and Switching Cycles

We present a comprehensive study of instabilities induced by positive and negative bias stress (PBS/NBS) in zinc oxide (ZnO) ferroelectric field-effect transistors (FeFETs), focusing on the dependence of threshold voltage (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">V</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>TH</roman></sub>) and memory window (MW) dynamics on channel thickness (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>CH</roman></sub>), channel length (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">L</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>CH</roman></sub>), and switching cycles. Based on Zr-doped HfO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>2</roman></sub> (HZO) and by optimizing <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>CH</roman></sub> and scaling <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">L</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>CH</roman></sub> down to 45 nm, high-performance ZnO FeFETs with an HZO–Al<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>2</roman></sub>O<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>3</roman></sub>–HZO ferroelectric (Fe) stack and an atomic layer deposition (ALD)-deposited channel are realized, achieving a large MW of 3.0 V, robust retention, and high endurance exceeding 10<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>8</roman></sup> cycles. Bias stress investigations reveal several key findings. First, devices with thinner <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>CH</roman></sub> exhibit higher <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">V</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>TH</roman></sub> susceptibility under PBS and NBS, which attributed to stronger electron trapping effects and the generation of more disorder state (DS) O<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>2</roman>-</sup> defects, respectively. Thanks to the strengthened effect of NBS-enhanced erasing, thinner <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>CH</roman></sub> results in better MW tolerance during NBS, thus partially offsetting the MW degradation due to polarization pinning. Second, this NBS-enhanced erasing effect is particularly pronounced in short-channel devices (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">L</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>CH</roman></sub> = 45 nm), even leading to an increase in MW. In contrast, during PBS, <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">L</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>CH</roman></sub> has little impact on <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">V</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>TH</roman></sub> and MW instabilities. Finally, it is observed that the degraded MW in heavily cycled devices can be slightly recovered after NBS.

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IEEE Transactions on Electron Devices
Published
2025-04-08
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https://doi.org/10.1109/ted.2025.3555263
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2
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Semiconductor materials and devices
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Comprehensive Investigation of Bias Stress-Induced Instabilities in Highly Scaled ZnO FeFETs: Impact of Channel Thickness, Channel Length, and Switching Cycles

Leming Jiao, Xiao Gong, Haiwen Xu, Qiwen Kong et al.
2 citations
IEEE Transactions on Electron Devices
Semiconductor materials and devices
1.46
article

Comprehensive Investigation of Bias Stress-Induced Instabilities in Highly Scaled ZnO FeFETs: Impact of Channel Thickness, Channel Length, and Switching Cycles

Leming Jiao, Xiao Gong, Haiwen Xu, Qiwen Kong, Gan Liu, Dong Zhang, Xiaolin Wang, Chen Sun, Yue Chen, Yang Feng, Rui Shao, Jishen Zhang
article en
2 citations

Abstract

We present a comprehensive study of instabilities induced by positive and negative bias stress (PBS/NBS) in zinc oxide (ZnO) ferroelectric field-effect transistors (FeFETs), focusing on the dependence of threshold voltage (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">V</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>TH</roman></sub>) and memory window (MW) dynamics on channel thickness (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>CH</roman></sub>), channel length (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">L</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>CH</roman></sub>), and switching cycles. Based on Zr-doped HfO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>2</roman></sub> (HZO) and by optimizing <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>CH</roman></sub> and scaling <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">L</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>CH</roman></sub> down to 45 nm, high-performance ZnO FeFETs with an HZO–Al<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>2</roman></sub>O<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>3</roman></sub>–HZO ferroelectric (Fe) stack and an atomic layer deposition (ALD)-deposited channel are realized, achieving a large MW of 3.0 V, robust retention, and high endurance exceeding 10<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>8</roman></sup> cycles. Bias stress investigations reveal several key findings. First, devices with thinner <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>CH</roman></sub> exhibit higher <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">V</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>TH</roman></sub> susceptibility under PBS and NBS, which attributed to stronger electron trapping effects and the generation of more disorder state (DS) O<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>2</roman>-</sup> defects, respectively. Thanks to the strengthened effect of NBS-enhanced erasing, thinner <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>CH</roman></sub> results in better MW tolerance during NBS, thus partially offsetting the MW degradation due to polarization pinning. Second, this NBS-enhanced erasing effect is particularly pronounced in short-channel devices (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">L</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>CH</roman></sub> = 45 nm), even leading to an increase in MW. In contrast, during PBS, <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">L</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>CH</roman></sub> has little impact on <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">V</i><sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>TH</roman></sub> and MW instabilities. Finally, it is observed that the degraded MW in heavily cycled devices can be slightly recovered after NBS.

IEEE Transactions on Electron DevicesVol. 72(5)
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