Utilization of Foamed Concrete-Based Resin Waste for Non-Loading Wall

Resin waste, which is the residual material from integrated circuit (IC) packages investigates widespread usage in the electronics industry. Hence, identifying efficient alternative methods to recycle this resin waste will significantly bolster the endeavor for a sustainable environment in construction applications. This study presents the utilization of foamed concrete-based resin waste (FC-RW) for non-loading walls. The process involved grinding the resin waste (RW) obtained from STMicroelectronics Sdn. Bhd. into particles sized 0.5 ± 0.02 mm. These particles were then mixed in varying proportions of 0, 5, 10, 15, 20, 25, and 30% with fixed amounts of cement, quartz sand, water, and synthetic foaming agent. The mixture was poured into molds and air-cured for 7 and 28 days. The study observed that water absorption and pores decreased as the proportion of RW increased. Analysis using a Scanning Electron Microscope (SEM) demonstrated that higher RW content led to a denser microstructure of FC-RW. FC-RW with 20% RW content exhibited the highest compressive strength of 0.94 MPa and 2.01 MPa after 7 and 28 days of curing, respectively. Even under elevated temperatures, FC-RW with 20% RW content retained the highest residual compressive strength at 6.07%. In conclusion, a composition of FC-RW with 20% RW content emerges as optimal, delivering superior values in water absorption, compressive strength before and after elevated temperatures. This research contributes to sustainable waste management, offers alternative green construction materials, enhances non-load wall concrete properties, and showcases technological innovation in the construction industry.