Biodegradable shellac-based substrates of various types for transient printed electronics
This work reports on the synthesis and properties of various shellac-based substrates for microelectronics applications. The analysis of the materials included temperature resistance and water solubility inspection. Low dielectric constant and dissipation factor as same as good integration of screen printed electrodes observed during SEM analysis, confirmed potential of shellac-based materials as substrates for transient, environmentally friendly electronic devices.
Institutions
- Cracow University of Technology (PL)
- Institute of Microelectronics (CN)
- Łukasiewicz Research Network (PL)
Publication Details
- Journal
- International Journal of Electronics and Telecommunications
- Published
- 2025-04-07
- DOI
- https://doi.org/10.24425/ijet.2025.153551
- Citations
- 1
- Primary Topic
- Additive Manufacturing and 3D Printing Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.68