Modelling the Bond Behavior and Tool Wear of Metal-Bonded Microfinishing Tools considering the Run-In Phase

Microfinishing processes are used to generate surfaces with roughness on a low micrometer or even nanometer scale. The stochastic characteristics of microfinishing tools significantly influence the resulting workpiece surface characteristics and the shape of finished components. As a result, a large number of experiments are required to identify suitable process parameter values to ensure the desired process outcomes. Important factors influencing the tool’s effect on the resulting workpiece surface and shape include the topography of individual diamond grains, grain distribution, the shape of the tool, as well as bond wear, which depends on the cutting path and process kinematics. To increase the efficiency of process planning, simulation systems can be utilized. These systems can support the identification of suitable process parameter values and analyze the influence of varying tool shapes on the resulting workpiece. To adequately analyze microfinishing in a process simulation, the aforementioned influencing factors must be modeled in detail. Therefore, in this study, a tool model was developed that not only represents the wear types of individual grains but also explicitly represents the bond material and its wear types. Based on the traveled cutting path of the microfinishing tool, an empirical wear model was developed to include grain tear-outs, bond ridges, and crater wear in the tool model. To identify suitable parameter values for the model, multi-grain scratch tests were conducted.