Towards monolithic integration of polymer-based electro-optical devices in silicon photonic integrated circuits using a 250nm SOI technology

Silicon-based photonic integrated circuits (PIC) in a complementary metal-oxide semiconductor (CMOS) technology are essential for next-generation communication systems and neuromorphic computing. Silicon lacks from efficient electro-optical (EO) effects. Since silicon is limiting the performance of current photonic devices, more advanced materials like nonlinear optical polymers are needed to unleash the full potential of PICs. As preliminary proof of concept we demonstrate the quadratic EO and electric field-induced EO effect by employing a Mach-Zehnder interferometer. Following our monolithic integration concept could open a way for next-generation PICs.

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Publication Details

Published
2025-04-04
DOI
https://doi.org/10.1117/12.3056280
Primary Topic
Photonic and Optical Devices
Type
article
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article

Towards monolithic integration of polymer-based electro-optical devices in silicon photonic integrated circuits using a 250nm SOI technology

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Photonic and Optical Devices
article

Towards monolithic integration of polymer-based electro-optical devices in silicon photonic integrated circuits using a 250nm SOI technology

Martin Paul, Robert Tannenberg, Andreas Mai, Patrick Steglich, Christian Mai, Christian Schümann, Tabea Fünning
article en

Abstract

Silicon-based photonic integrated circuits (PIC) in a complementary metal-oxide semiconductor (CMOS) technology are essential for next-generation communication systems and neuromorphic computing. Silicon lacks from efficient electro-optical (EO) effects. Since silicon is limiting the performance of current photonic devices, more advanced materials like nonlinear optical polymers are needed to unleash the full potential of PICs. As preliminary proof of concept we demonstrate the quadratic EO and electric field-induced EO effect by employing a Mach-Zehnder interferometer. Following our monolithic integration concept could open a way for next-generation PICs.

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