Innovative Thermal Solutions for 3D Heterogeneous Integration of Co-Packaged Optics

3D Heterogeneous Integration (3DHI) of copackaged optics (CPO) emerges as a promising low-power, lowlatency, and high-bandwidth IO solution for the ever-growing datacenter, AI and IoT applications. However, the design and co-optimization of heterogeneous integration of electrical and photonics system is very challenging by multiscale modeling and multiphysics integrity concerns. In this work, a novel thermal simulation solution is proposed to tackle the model accuracy, mesh fidelity and multi-scale challenges. A typical CPO design in 3DHI stacking system has demonstrated a comprehensive workflow to handle heater ring and waveguide structures and predict the vertical thermal coupling effects and thermal hotspots of the entire SiPh system.