Hygroscopic stresses development in epoxy-metal bonded assemblies under hydrothermal conditions

Authors

Eduardo Martins Sampaio (ORCID: https://orcid.org/0000-0002-0339-0716)
Romain Grangeat (ORCID: https://orcid.org/0000-0002-5735-223X)
Sílvio de Barros (ORCID: https://orcid.org/0000-0002-2520-569X)
Amanda Maria Nascimento (ORCID: https://orcid.org/0000-0002-0020-1350)
E. Pinto
Hector Ravon

Institutions

Universidade do Estado do Rio de Janeiro (BR)
Cole Engineering Services (United States) (US)
Federal Center for Technological Education of Minas Gerais (BR)
Universidade Federal Rural do Semi-Árido (BR)

Publication Details

Journal: The Journal of Adhesion
Published: 2025-04-03
DOI: https://doi.org/10.1080/00218464.2025.2488319
Primary Topic: Epoxy Resin Curing Processes
Type: article
Field-Weighted Citation Impact: 0.00

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article

Hygroscopic stresses development in epoxy-metal bonded assemblies under hydrothermal conditions

Eduardo Martins Sampaio, Romain Grangeat, Sílvio de Barros, Amanda Maria Nascimento et al.

Apr 3, 2025

The Journal of Adhesion

Epoxy Resin Curing Processes

article

Hygroscopic stresses development in epoxy-metal bonded assemblies under hydrothermal conditions

Eduardo Martins Sampaio, Romain Grangeat, Sílvio de Barros, Amanda Maria Nascimento, E. Pinto, Hector Ravon

April 3, 2025article en

Abstract

No abstract available for this paper.

The Journal of AdhesionVol. 101(14)

Universidade do Estado do Rio de Janeiro (BR), Cole Engineering Services (United States) (US), Federal Center for Technological Education of Minas Gerais (BR), Universidade Federal Rural do Semi-Árido (BR)

Openalex Percentile: Top 94%

Epoxy Resin Curing Processes

DOI Open Access PDF OpenAlex

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