Direct RF FPGAs Built with Multi-Chip Packaging Overcome Technology Challenges

The wideband Altera™ Agilex™ 9 Direct RF-Series portfolio is a leap forward which enables the implementation of direct RF systems in a single package RF FPGA. This development included the integration of existing technologies and creating solutions for new challenges.

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Publication Details

Published
2024-09-23
DOI
https://doi.org/10.1109/hpec62836.2024.10938522
Citations
1
Primary Topic
Radio Frequency Integrated Circuit Design
Type
article
Field-Weighted Citation Impact
0.21
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article

Direct RF FPGAs Built with Multi-Chip Packaging Overcome Technology Challenges

D. Henderson, Marjorie Catt
1 citations
Radio Frequency Integrated Circuit Design
0.21
article

Direct RF FPGAs Built with Multi-Chip Packaging Overcome Technology Challenges

D. Henderson, Marjorie Catt
article en
1 citations

Abstract

The wideband Altera™ Agilex™ 9 Direct RF-Series portfolio is a leap forward which enables the implementation of direct RF systems in a single package RF FPGA. This development included the integration of existing technologies and creating solutions for new challenges.

Intel (United States) (US), Altera (United States) (US)
Openalex Percentile: Top 43%
Radio Frequency Integrated Circuit Design
0.21
DOISourceOpenAlex
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Direct RF FPGAs Built with Multi-Chip Packaging Overcome Technology Challenges — D. Henderson, Marjorie Catt · (2024) | TGRS Research Map | TGRS