Low-Voltage Gallium Oxide Memristor with Enhanced Cyclic Endurance, Stability, and Memory Window

We present an Al/Cu/GaOx/Au memristor that combines low-voltage operation (set and reset voltages of 0.48 and −0.3 V, respectively), high cyclic endurance (>13,987 cycles), a large memory window (∼4900), and stable multilevel resistance states. These outstanding properties are achieved by leveraging the synergistic interaction between a Cu-based electrochemical metallization mechanism and a GaOx intermediate layer. Comparative studies and atomistic simulations reveal that the low energy barrier for Cu diffusion into GaOx is pivotal in enhancing device performance, enabling superior functionality compared to previously reported GaOx-based memristors. This memristor supports reliable multilevel resistance programming via compliance current modulation and voltage-controlled filament rupture. Furthermore, its exceptional endurance, among the highest reported for GaOx memristors, was validated through rigorous current–voltage cycling tests and voltage pulse measurements. This work establishes the Al/Cu/GaOx/Au memristor as a promising configuration for advancing nonvolatile memory technologies, offering significant potential for high-performance, low-power storage, and neuromorphic computing solutions.

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Publication Details

Journal
ACS Applied Electronic Materials
Published
2025-04-03
DOI
https://doi.org/10.1021/acsaelm.4c02238
Citations
1
Primary Topic
Advanced Memory and Neural Computing
Type
article
Field-Weighted Citation Impact
0.73

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Low-Voltage Gallium Oxide Memristor with Enhanced Cyclic Endurance, Stability, and Memory Window

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ACS Applied Electronic Materials
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article

Low-Voltage Gallium Oxide Memristor with Enhanced Cyclic Endurance, Stability, and Memory Window

Meng Lu, Liang Dong, Avishek Das, Raufur Rahman Khan, Cheng Wang, Oh‐Hyung Kwon, Jacob S Eisbrenner
article en
1 citations

Abstract

We present an Al/Cu/GaOx/Au memristor that combines low-voltage operation (set and reset voltages of 0.48 and −0.3 V, respectively), high cyclic endurance (>13,987 cycles), a large memory window (∼4900), and stable multilevel resistance states. These outstanding properties are achieved by leveraging the synergistic interaction between a Cu-based electrochemical metallization mechanism and a GaOx intermediate layer. Comparative studies and atomistic simulations reveal that the low energy barrier for Cu diffusion into GaOx is pivotal in enhancing device performance, enabling superior functionality compared to previously reported GaOx-based memristors. This memristor supports reliable multilevel resistance programming via compliance current modulation and voltage-controlled filament rupture. Furthermore, its exceptional endurance, among the highest reported for GaOx memristors, was validated through rigorous current–voltage cycling tests and voltage pulse measurements. This work establishes the Al/Cu/GaOx/Au memristor as a promising configuration for advancing nonvolatile memory technologies, offering significant potential for high-performance, low-power storage, and neuromorphic computing solutions.

ACS Applied Electronic MaterialsVol. 7(8)
Iowa State University (US)
National Institute of Food and Agriculture, Division of Computer and Network Systems
Affordable and clean energy
Openalex Percentile: Top 30%
Advanced Memory and Neural Computing
0.73
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