Resonant High-Pressure Microsensors With Stress Redistributions Based on Supporting Micro-Beams

This letter introduces a resonant high-pressure microsensor, which utilizes a single pair of supporting micro-beams to achieve stress redistribution along the resonators through volume-compressed sensing. The principle of stress redistributions by supporting micro-beams was discussed and through an orthogonal parameter analysis, the influence weights of geometric parameters are determined. Microfabrication was conducted to fabricate the microsensor and the pressure sensitivities were quantified as 0.125 kHz/MPa of Resonator I, −0.122 kHz/MPa of Resonator II, and 0.247 kHz/MPa of the differential output of the dual resonators under 20°C and the resolution is quantified as 0.00014%FS over a 70MPa full scale. This study introduces a novel supporting micro-beam design that achieves flexible stress redistribution through the simple and compact structure. This breakthrough enables unprecedented adaptability of pressure sensitivity across wide measurement ranges and thermal conditions while maintaining structural simplicity.

Authors

Institutions

Publication Details

Journal
IEEE Electron Device Letters
Published
2025-04-03
DOI
https://doi.org/10.1109/led.2025.3557438
Citations
2
Primary Topic
Advanced MEMS and NEMS Technologies
Type
article
Field-Weighted Citation Impact
1.46

Funders

Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Resonant High-Pressure Microsensors With Stress Redistributions Based on Supporting Micro-Beams

P.D. Ye, Deyong Chen, Yulan Lu, Zongze Yu et al.
2 citations
IEEE Electron Device Letters
Advanced MEMS and NEMS Technologies
1.46
article

Resonant High-Pressure Microsensors With Stress Redistributions Based on Supporting Micro-Beams

P.D. Ye, Deyong Chen, Yulan Lu, Zongze Yu, Jian Chen, Bo Xie, Junbo Wang
article en
2 citations

Abstract

This letter introduces a resonant high-pressure microsensor, which utilizes a single pair of supporting micro-beams to achieve stress redistribution along the resonators through volume-compressed sensing. The principle of stress redistributions by supporting micro-beams was discussed and through an orthogonal parameter analysis, the influence weights of geometric parameters are determined. Microfabrication was conducted to fabricate the microsensor and the pressure sensitivities were quantified as 0.125 kHz/MPa of Resonator I, −0.122 kHz/MPa of Resonator II, and 0.247 kHz/MPa of the differential output of the dual resonators under 20°C and the resolution is quantified as 0.00014%FS over a 70MPa full scale. This study introduces a novel supporting micro-beam design that achieves flexible stress redistribution through the simple and compact structure. This breakthrough enables unprecedented adaptability of pressure sensitivity across wide measurement ranges and thermal conditions while maintaining structural simplicity.

IEEE Electron Device LettersVol. 46(6)
Chinese Academy of Sciences (CN), State Key Laboratory of Transducer Technology (CN), Aerospace Information Research Institute (CN)
National Natural Science Foundation of China, Youth Innovation Promotion Association of the Chinese Academy of Sciences, National Key Research and Development Program of China
Climate action
Openalex Percentile: Top 18%
Advanced MEMS and NEMS Technologies
1.46
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.

Resonant High-Pressure Microsensors With Stress Redistributions Based on Supporting Micro-Beams — P.D. Ye, Deyong Chen, et al. · IEEE Electron Device Letters (2025) | TGRS Research Map | TGRS