Semi-curing combined with low-pressure mechanical pressing strategy for realizing high adhesion and low surface roughness Ag-NW transparent electrodes
Semi-curing combined with low-pressure pressing imparts high adhesion, low surface roughness, and exceptional mechanical and optoelectronic performance to Ag-NW transparent electrodes.
Authors
- Mohan Li (ORCID: https://orcid.org/0000-0001-9890-9244)
- Huagui Nie
- Ying Sui (ORCID: https://orcid.org/0009-0005-7374-6721)
- Zhi Yang (ORCID: https://orcid.org/0000-0002-9265-5041)
- Yongjie Ge (ORCID: https://orcid.org/0000-0002-2959-2914)
- Yiwen Du
- He Huang (ORCID: https://orcid.org/0000-0003-1935-8275)
- Hui Wang (ORCID: https://orcid.org/0000-0002-9289-9927)
- Ling Ye (ORCID: https://orcid.org/0000-0003-1335-7669)
- Longlong Huang (ORCID: https://orcid.org/0000-0001-6176-5005)
- Yingying Kang (ORCID: https://orcid.org/0000-0002-1458-8349)
Institutions
- Wenzhou University (CN)
Publication Details
- Journal
- Journal of Materials Chemistry A
- Published
- 2025-01-01
- DOI
- https://doi.org/10.1039/d5ta00523j
- Citations
- 3
- Primary Topic
- Nanomaterials and Printing Technologies
- Type
- article
- Field-Weighted Citation Impact
- 2.19
Funders
- National Natural Science Foundation of China
- Wenzhou Municipal Science and Technology Bureau
- Wenzhou University