Research progress of metal-based thermal interface materials

The future development of electronic devices will be characterised by miniaturisation, integration and high power output, which will in turn require significantly increased heat dissipation capabilities. Inadequate and untimely dissipation of heat to the environment through heat sinks can severely impact the lifetime and stability of electronic devices, making efficient thermal management materials at interfaces crucial. To enhance the effectiveness of thermal management, the incorporation of thermal interface materials (TIMs) can facilitate the filling of the irregular surface of the interface between the electronic components and the heat sink. Although TIMs have received significant attention, there have been few systematic discussions on metal-based TIMs. This paper reviews the existing types and characteristics of TIMs, focusing on metal-based TIMs, their types, characteristics, and research progress, while also discussing current technical challenges and future development directions.