Selective injection AlGaN/GaN heterojunction bipolar transistors with patterned regrown base contacts

We demonstrate graded AlGaN/GaN heterojunction bipolar transistors (HBTs) with selective injection of minority carriers across a p-GaN base and patterned regrown base contacts. The selective injection design regulates minority carrier transport under emitter–base forward bias through a thin base region, while thick and highly doped p+ GaN regrown layers patterned alongside the thin base regions are utilized to lower the base contact resistance. With SiO2 employed as a spacer between the emitter and the p+ regrown layers, the device with an interdigitated emitter/base-contact stripe design displayed a maximum collector current density (IC) of 101 kA/cm2 and a maximum current gain (β) of 70 at IC ∼1 kA/cm2 and ∼11 for IC > 50 kA/cm2. The reported results demonstrate the potential of the selective injection approach to break the long-existing HBT design trade-off between base resistance and current gain for next-generation radio frequency and millimeter wave applications.

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Publication Details

Journal
APL Electronic Devices
Published
2025-04-01
DOI
https://doi.org/10.1063/5.0249838
Citations
1
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
1.26

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article

Selective injection AlGaN/GaN heterojunction bipolar transistors with patterned regrown base contacts

Shahadat H. Sohel, Sheikh Ifatur Rahman, Siddharth Rajan, Chandan Joishi et al.
1 citations
APL Electronic Devices
GaN-based semiconductor devices and materials
1.26
article

Selective injection AlGaN/GaN heterojunction bipolar transistors with patterned regrown base contacts

Shahadat H. Sohel, Sheikh Ifatur Rahman, Siddharth Rajan, Chandan Joishi, Zhanbo Xia
article en
1 citations

Abstract

We demonstrate graded AlGaN/GaN heterojunction bipolar transistors (HBTs) with selective injection of minority carriers across a p-GaN base and patterned regrown base contacts. The selective injection design regulates minority carrier transport under emitter–base forward bias through a thin base region, while thick and highly doped p+ GaN regrown layers patterned alongside the thin base regions are utilized to lower the base contact resistance. With SiO2 employed as a spacer between the emitter and the p+ regrown layers, the device with an interdigitated emitter/base-contact stripe design displayed a maximum collector current density (IC) of 101 kA/cm2 and a maximum current gain (β) of 70 at IC ∼1 kA/cm2 and ∼11 for IC > 50 kA/cm2. The reported results demonstrate the potential of the selective injection approach to break the long-existing HBT design trade-off between base resistance and current gain for next-generation radio frequency and millimeter wave applications.

APL Electronic DevicesVol. 1(2)
The Ohio State University (US)
Office of Naval Research
Openalex Percentile: Top 23%
GaN-based semiconductor devices and materials
1.26
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